Compare robots 1 robots · up to 4

Specification
仙工智能
SEER AMB-300
Mobile Chassis
官方未公开标准售价;联系仙工智能获取人民币报价
Basic Information
Positioning / Application智能移动机器人底盘;激光 SLAM,导航定位精度 ±5 mm、角度精度 ±0.5°
Release Date2023
Country中国
Model AliasAMB-300
Made In中国
Overall Specifications
Weight (kg)144
Height (mm)200
Material—
Noise Level (dB)—
Width (mm)700
Folded Dimensions (mm)—
Locomotion Typewheeled
Color—
Motion Performance
Max Speed (m/s)1.4
Payload (kg)300
Peak Joint Torque (N·m)—
Max Gradient (°)—
Max Step Height (cm)5
Jumping Capability (m)—
Degrees of Freedom
Total DOF (DOF)—
Waist DOF (DOF)—
Mechanical Structure
Joint Type—
Joint Encoder—
Joint Range of Motion—
Sensors
Sensors激光雷达;可选反光柱导航、二维码精准定位及 3D 避障模块
Camera—
LiDAR标配 1 个激光雷达(P+F/H1),可选 2 个
IMU—
Obstacle Avoidance基础安全避障;可选 3D 避障
Battery & Endurance
Battery Capacity (Wh)—
Runtime (h)12
Charging Time (h)1.5
Battery Voltage (V)48
Power Supply (V)—
Hot-swappable—
Charging Power (W)—
Charging Method手动充电 / 自动充电 / 快换电池;10%–80% 充电时间 ≤1.5 h
Compute Platform
Onboard Compute—
AI Compute Module—
Compute (TOPS) (TOPS)—
Operating System—
CPU Cores (核)—
Safety & Environment
Ingress Protection (IP)—
Operating Temperature (°C)0–50
Pinch Protection—
Interaction & Communication
CommunicationWi-Fi 漫游;支持 MES 对接与多机调度
Microphone—
Speaker扬声器
Lighting氛围灯
Voice Interaction—
OTA Update—
Development & Expansion
Secondary Development (SDK)SRC 控制器平台;支持 MES 对接与多机器人调度集成
Expansion Backplane—
App Platform—
Commercial Information
Warranty (年)—