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| Specification |  PAL Robotics REEM-B双足人形 PAL Robotics 官方明确为研究原型、不商业销售 |
|---|---|
| Basic Information | |
| Positioning / Application | 双足服务机器人研究原型 |
| Release Date | 2008 |
| Country | 西班牙 |
| Model Alias | — |
| Made In | 西班牙 |
| Overall Specifications | |
| Weight (kg) | 60 |
| Height (mm) | 1470 |
| Material | — |
| Noise Level (dB) | — |
| Width (mm) | 500 |
| Folded Dimensions (mm) | — |
| Locomotion Type | biped |
| Color | — |
| Motion Performance | |
| Max Speed (m/s) | 0.4167 |
| Payload (kg) | 14 |
| Peak Joint Torque (N·m) | — |
| Max Gradient (°) | — |
| Max Step Height (cm) | — |
| Jumping Capability (m) | — |
| Degrees of Freedom | |
| Total DOF (DOF) | 41 |
| Waist DOF (DOF) | — |
| Mechanical Structure | |
| Joint Type | — |
| Joint Encoder | — |
| Joint Range of Motion | — |
| Sensors | |
| Sensors | 头部立体相机、麦克风、六轴力/力矩传感器、加速度计、陀螺仪、超声波与激光测距传感器 |
| Camera | 头部立体相机 |
| LiDAR | — |
| IMU | — |
| Obstacle Avoidance | — |
| Battery & Endurance | |
| Battery Capacity (Wh) | — |
| Runtime (h) | 2 |
| Charging Time (h) | — |
| Battery Voltage (V) | — |
| Power Supply (V) | — |
| Hot-swappable | — |
| Charging Power (W) | — |
| Charging Method | — |
| Compute Platform | |
| Onboard Compute | Intel Core Duo 1.66 GHz + AMD Geode 500 MHz |
| AI Compute Module | — |
| Compute (TOPS) (TOPS) | — |
| Operating System | Linux |
| CPU Cores (核) | — |
| Safety & Environment | |
| Ingress Protection (IP) | — |
| Operating Temperature (°C) | — |
| Pinch Protection | — |
| Interaction & Communication | |
| Communication | — |
| Microphone | — |
| Speaker | — |
| Lighting | — |
| Voice Interaction | — |
| OTA Update | — |
| Development & Expansion | |
| Secondary Development (SDK) | — |
| Expansion Backplane | — |
| App Platform | — |
| Commercial Information | |
| Warranty (年) | — |